The federal government is investing an additional $210 million in IBM’s semiconductor packaging plant in Bromont, Quebec. The funding, delivered via the Strategic Innovation Fund, supports new equipment and collaboration with R&D hub C2MI.
IBM is midway through a $1-billion upgrade plan for the site—North America’s largest semiconductor packaging facility—where chips are assembled, cooled, and protected for use. Ottawa previously awarded $59.9 million to the project in 2024. IBM’s expanded capabilities are key to reshoring chip production amid geopolitical uncertainty, with Bromont supporting U.S. fabrication efforts tied to the CHIPS Act.
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