IBM has revealed groundbreaking co-packaged optics (CPO) research, enabling optical communication inside data centers for faster AI processing. By using polymer optical waveguides (PWG), IBM’s innovation could deliver 80x faster bandwidth than current chip connections.
CPO technology promises to reduce energy consumption by over 5x, cut AI model training times from three months to three weeks, and save energy equivalent to 5,000 U.S. homes annually. The innovation boosts chip interconnect density and ensures reliability under extreme conditions. “This breakthrough will future-proof data centers for AI demands,” said Dario Gil, IBM’s SVP of Research.
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